Cold Plate Heat Sink For CPU Microprocessor Electronic Devices
|
Business Type
|
Factory / Manufacturer
|
|
Products
|
Skiving Fin Heatsinks, Liquid Cold Plates, Extruded Heatsinks, Stamping Heatsinks, Heat Pipe Heatsinks, Vapor Chamber, CNC Machined Parts
|
|
Type
|
Heatsinks
|
|
Service
|
OEM service, professional R&D support
|
|
Material
|
Aluminum/copper
|
|
Tool Cost
|
No Needed
|
|
Process
|
Cutting, Skiving, Extruded, Stamping, Rolling, Broaching, Punching, Drilling, Bending, Welding, Milling, Turning, CNC Machining, Grinding, Deburring, Cleaning, 100% Inspection, Packing, Delivery
|
|
Surface treatment
|
Polishing, anodizing, powder coating, passivating, painting, plating, sand blasting, e-coating and others as your requested
|
|
Dimension
|
Customized (The maximum size of the skived heat sink can be W 1200 * L 3500mm)
|
|
Inspection
|
CMM , Two dimensional measuring instrument, Projector, Flatness measurer, Roughness measurer, Helium leaking testing equipment
|
|
Delivery time
|
The sample lead time is 15-21 days. The production lead time is 25 days.
|
|
Application
|
Photovoltaics, Wind Power, Communications, LED, Electric Vehicles, Medical, Rail Transit, Microwaves,
Automobile, Lasers, High Power Solar Inverter, High Power LED light, Data Center, IGBT cooling, Welding Machine, Artificial
Intelligence etc.
|
With the rise of AI and HPC, which require processing massive amounts of data, it is foreseeable that next-generation processors will run faster than today's high-end processors and generate even more heat. The TDP (Thermal Design Power) of CPUs and GPUs will continue to increase. BY Thermal's liquid cooling solutions can maximize heat dissipation efficiency, improve PUE values, and increase computing density per rack. Liquid cooling is expected to play a key role in shaping the future of data centers.
Applications in High-end Manufacturing
Semiconductor and Chip Manufacturing
Advanced packaging technologies (e.g., 3D stacking) lead to heat accumulation inside chips, where the thermal conductivity of traditional materials has become a bottleneck.
AI Computing/Data Centers
With the surging heat flux density of chips, traditional cooling methods are struggling to meet the demand, making thermal management an "invisible ceiling" that restricts the improvement of computing power.
Aerospace
The space environment features extreme temperatures and high vacuum, where convective heat dissipation is not feasible.
As a result, aerospace equipment is exposed to harsh temperature fluctuations.
Applications in Daily Life
Digital Devices
Internal heat dissipation modules composed of metal cooling fins are fitted in computers, mobile phones, game consoles and other devices to ensure their sustained performance.
Communication Devices
To guarantee the stability of high-speed data transmission and processing, these devices are usually equipped with large heat sinks.
Household Appliances
Compressors and external unit condensers require efficient heat dissipation performance, as they continuously transfer heat from indoor spaces to the outdoors.
Lighting Devices
Efficient heat dissipation design ensures the luminous efficacy and long service life of LED lamp beads; the realization of energy conservation is inseparable from the support of heat dissipation technology.
New Energy Vehicles
New energy vehicles require a sophisticated liquid cooling system to maintain an optimal operating temperature.
Company Advantages
The mold workshop is equipped with 22 sets of electric discharge machines (EDM) of various types, including 2 MAKINO mirror EDM machines. It also has 9 wire-cut EDM machines (low-speed), among which 3 are Seibu wire-cut EDM machines and 1 is Sodick wire-cut EDM machine imported from Japan. In addition, the workshop is furnished with 7 spark erosion machines, 10 grinding machines, 2 milling machines and 1 lathe.
Powerful Equipment & Hardware Capabilities:
Table size: 500×350 mm
Rapid traverse speed: 5000 mm/min
Maximum workpiece weight: 500 kg
Maximum electrode weight: 50 kg
High Machining Precision:
Adopting the new SuperSpark4 and IES (Intelligent Expert System) technologies, we provide advanced adaptive power supply and jump control to stabilize the EDM process and improve machining precision simultaneously. Equipped with advanced ultra-surface and ultra-edge generator technologies, the workshop is capable of achieving excellent surface finish and metallurgical quality.
Product Applications
Quality Assurance
We maintain rigorous quality standards with comprehensive testing equipment including:
- 1 Coordinate Measuring Machine
- 1 projector instrument
- 2 water high pressure testing machines
- 4 thermal resistance testing machines
- 2 liquid leakage testing machines
Customer Service Commitment
- Prompt response to all inquiries
- Competitive pricing with guaranteed quality
- Efficient production scheduling
- Optimal transportation solutions
- Comprehensive technical support
Frequently Asked Questions
Are you a trading company or manufacturer? We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.
Have you exported goods before and to which regions? 60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.
How many employees do you have? Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.
Can you provide samples if we agree with the design? Yes, we provide samples for confirmation before mass production, along with technical drawings if required.
What packing methods do you use? Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.
Do you provide technical support for product issues? All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.
